BS EN 60749-30-2005 半导体器件.机械和气候试验方法.第30部分:可靠性测试之前非气密表面安装器件的预调试
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【英文标准名称】:Semiconductordevices-Mechanicalandclimatictestmethods-Part30:Preconditioningofnon-hermeticsurfacemountdevicespriortoreliabilitytesting
【原文标准名称】:半导体器件.机械和气候试验方法.第30部分:可靠性测试之前非气密表面安装器件的预调试
【标准号】:BSEN60749-30-2005
【标准状态】:作废
【国别】:英国
【发布日期】:2006-01-27
【实施或试行日期】:2006-01-27
【发布单位】:英国标准学会(GB-BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:大气压;温度变化;气候;气候的;气候试验;组件;明确;定义;尺寸;电气工程;电学测量;电子工程;电子设备及元件;环境;环境试验;环境实验;易燃性;热学;集成电路;机械试验;潮气;温湿度预调节;可靠度;可靠性试验;耐力;半导体器件;半导体;表面安装设备;表面安装;温度;试验;密封性;外观检查(试验)
【英文主题词】:Atmosphericpressure;Changesoftemperature;Climate;Climatic;Climatictests;Components;Definition;Definitions;Dimensions;Electricalengineering;Electricalmeasurement;Electronicengineering;Electronicequipmentandcomponents;Environment;Environmentaltesting;Environmentaltests;Flammability;Heat;Integratedcircuits;Mechanicaltesting;Moisture;Preconditioning;Reliability;Reliabilitytesting;Resistance;Semiconductordevices;Semiconductors;SMD;Surfacemounting;Temperature;Testing;Tightness;Visualinspection(testing)
【摘要】:ThispartofIEC60749establishesastandardprocedurefordeterminingthepreconditioningofnon-hermeticsurfacemountdevices(SMDs)priortoreliabilitytesting.Thetestmethoddefinesthepreconditioningflowfornon-hermeticsolid-stateSMDsrepresentativeofatypicalindustrymultiplesolderreflowoperation.TheseSMDsshouldbesubjectedtotheappropriatepreconditioningsequencedescribedinthisstandardpriortobeingsubmittedtospecificin-housereliabilitytesting(qualificationand/orreliabilitymonitoring)inordertoevaluatelongtermreliability(impactedbysolderingstress).NOTECorrelationofmoisture-inducedstresssensitivityconditions(ormoisturesensitivitylevels(MSL))inaccordancewithIEC60749-20andthisspecificationandactualreflowconditionsusedaredependentuponidenticaltemperaturemeasurementbyboththesemiconductormanufacturerandtheboardassembler.Therefore,itisrecommendedthatthetemperatureatthetopofthepackageonthehottestmoisturesensitiveSMDduringassemblybemonitoredtoensurethatitdoesnotexceedthetemperatureatwhichthecomponentsareevaluated.
【中国标准分类号】:L40
【国际标准分类号】:31_080_01
【页数】:16P.;A4
【正文语种】:英语
【原文标准名称】:半导体器件.机械和气候试验方法.第30部分:可靠性测试之前非气密表面安装器件的预调试
【标准号】:BSEN60749-30-2005
【标准状态】:作废
【国别】:英国
【发布日期】:2006-01-27
【实施或试行日期】:2006-01-27
【发布单位】:英国标准学会(GB-BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:大气压;温度变化;气候;气候的;气候试验;组件;明确;定义;尺寸;电气工程;电学测量;电子工程;电子设备及元件;环境;环境试验;环境实验;易燃性;热学;集成电路;机械试验;潮气;温湿度预调节;可靠度;可靠性试验;耐力;半导体器件;半导体;表面安装设备;表面安装;温度;试验;密封性;外观检查(试验)
【英文主题词】:Atmosphericpressure;Changesoftemperature;Climate;Climatic;Climatictests;Components;Definition;Definitions;Dimensions;Electricalengineering;Electricalmeasurement;Electronicengineering;Electronicequipmentandcomponents;Environment;Environmentaltesting;Environmentaltests;Flammability;Heat;Integratedcircuits;Mechanicaltesting;Moisture;Preconditioning;Reliability;Reliabilitytesting;Resistance;Semiconductordevices;Semiconductors;SMD;Surfacemounting;Temperature;Testing;Tightness;Visualinspection(testing)
【摘要】:ThispartofIEC60749establishesastandardprocedurefordeterminingthepreconditioningofnon-hermeticsurfacemountdevices(SMDs)priortoreliabilitytesting.Thetestmethoddefinesthepreconditioningflowfornon-hermeticsolid-stateSMDsrepresentativeofatypicalindustrymultiplesolderreflowoperation.TheseSMDsshouldbesubjectedtotheappropriatepreconditioningsequencedescribedinthisstandardpriortobeingsubmittedtospecificin-housereliabilitytesting(qualificationand/orreliabilitymonitoring)inordertoevaluatelongtermreliability(impactedbysolderingstress).NOTECorrelationofmoisture-inducedstresssensitivityconditions(ormoisturesensitivitylevels(MSL))inaccordancewithIEC60749-20andthisspecificationandactualreflowconditionsusedaredependentuponidenticaltemperaturemeasurementbyboththesemiconductormanufacturerandtheboardassembler.Therefore,itisrecommendedthatthetemperatureatthetopofthepackageonthehottestmoisturesensitiveSMDduringassemblybemonitoredtoensurethatitdoesnotexceedthetemperatureatwhichthecomponentsareevaluated.
【中国标准分类号】:L40
【国际标准分类号】:31_080_01
【页数】:16P.;A4
【正文语种】:英语
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